1. 改进电子制造业集群计划|Modified Electronics Manufacturing Clusters Scheme
概述 Overview
改进电子制造业集群计划（EMC 2.0）旨在加强电子工业的基础设施建设，深化印度的电子价值链。公用设施中心、现成厂房、厂棚/即插即用设备等行业专用设施的开发，不仅可以加强供应链响应能力，促进供应商整合，还可以缩短投放市场时间，降低物流成本。因此，EMC 2.0是为专业电子制造商制定的财政激励计划，鼓励建立优质的基础设施以及公用设施和便利设施。高达376.2亿印度卢比的财政激励补贴将在8年内发放。
The Modified Electronics Manufacturing Clusters (EMC 2.0) Scheme seeks to strengthen the infrastructure base for the electronics industry and deepen the electronics value chain in India. The development of industry-specific facilities like Common Facility Centers, Ready Built Factory, Sheds/Plug and Play facilities will not only strengthen supply chain responsiveness and promote the consolidation of suppliers but also decrease time-to-market and lower logistics costs. EMC 2.0, therefore, provides financial incentives for creating quality infrastructure as well as common facilities and amenities for electronics manufacturers. Financial Incentives of up to INR 3,762 Crore will be disbursed over a period of 8 years.
资格 | Eligibility
对锚定企业的要求
Requirement of Anchor Units
购买/租赁面积不少于20%的项目用地
Purchase/lease at-least 20% of the land area
投资额不低于30亿印度卢比（东北部邦、山地邦、联邦属地为15亿印度卢比）
A minimum investment commitment of INR 300 crore (INR 150 Crore for North-Eastern States, Hill States, UTs)
电子制造集群（EMC）项目
EMC Projects
财政激励补贴高达项目成本的50%，每100英亩土地的补贴高达7亿印度卢比
Financial incentives of up to 50% of project cost will be awarded, subject to a ceiling of INR 70 crore for every 100 acres of land
新项目
New Projects
项目用地面积不小于200英亩（东北州、山地州、联邦属地为100英亩）
Minimum Land Area: 200 acres (100 acres for North-Eastern States, Hill States, UTs)
最高累计补贴：每个项目35亿印度卢比
Overall ceiling: INR 350 crore per project
扩展类项目Expansion-Related Projects
项目用地最小扩展面积：毗邻的100英亩（东北部邦、山地邦、联邦属地为毗邻的50英亩）Minimum Land Area: 100 acres adjoining (50 acres adjoining for North-Eastern States, Hill States, UTs)
百分之八十可供出售/出租的土地需规划为电子系统设计和制造企业用地
80% of saleable/leasable land should be allotted to ESDM units
不少于50%的已批出土地已经开展生产活动
At least 50% of land allotted should have started production activity
公共设施中心（CFC）Common Facility Centres (CFC)
补贴75%的项目成本，上限为7.5亿印度卢比
75% of the project cost will be awarded, subject to a ceiling of INR 75 crore
5个电子制造企业确认为其用户
5 electronics manufacturing units identified as users
*1英亩约为4047平方米
*An acre is about 4,047 square meters
2. 电子元件和半导体生产促进计划（SPECS）
概述 Overview
低成本娴熟劳动力，快速改善的基础设施，以及政府在国内推动的便利营商环境政策，使印度有潜力成为全球零部件制造中心。2018-19年，印度电子元件市场规模增长至208亿美元，复合年增长率为32%。此外，预计到2025年，印度电子元件市场规模约为2000亿美元。
India has the potential to become a global hub for components manufacturing due to availability of cost-effective skilled manpower, fast improving infrastructure and the Government’s push for Ease of Doing Business in the country. The size of Indian electronic components market has increased at a CAGR of 32% to $20.8 bn in 2018-19. Moreover, the market opportunity for electronic components in India is expected to be around $200 bn by 2025.
电子元件和半导体生产促进计划（SPECS）旨在加强电子元件和半导体制造业的生态系统。通过该计划推动电子元件和半导体制造业发展，将有助于满足国内需求，提升附加值，并增加该行业的就业机会。
The Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS) aims to strengthen the manufacturing ecosystem for electronic components and semiconductors. Target manufacturing of electronic components and semiconductors through the scheme will help meet domestic demand, increase value addition and promote employment opportunities in this sector.
根据计划，高达328.5亿印度卢布的激励补贴将在8年内发放。
Incentives of up to INR 3,285 crore will be awarded under the Scheme over a period of 8 years.
亮点 | Highlights
激励 | Incentive
以报销方式补贴25%与厂房、机器、设备、相关设施和技术、包括研发有关联的资本支出
Incentive of 25% on Capital Expenditure pertaining to plant, machinery, equipment, associated utilities and technology, including Research & Development on reimbursement basis.目标产业 | Target Segments
电子元件、半导体、上述产品的专属半成品及资本货物
Electronic Components, Semiconductors, Specialized Sub-Assemblies and Capital Goods for these items申请资格 | Eligibility
适用于新投资项目及现有项目的扩建
Applicable to Investments in New Units as well as Expansion of Existing Units
计划年限 | Tenure of the Scheme
电子元件和半导体生产促进计划（SPECS）将有3年的开放申请时间。自登记确认日起5年内的投资，将获得申请补贴的资格。
SPECS will be open for applications for 3 years. Investments made within 5 years from the date of acknowledgement will be eligible for receiving incentive.
3. 大规模电子制造业的生产挂钩激励计划 | PLI Scheme for Large Scale Electronics Mfg
概述 Overview
大规模电子制造业的生产挂钩激励计划(PLI)提出了一项财政激励措施，以促进国内制造业，并在电子价值链上吸引大量投资，包括手机、电子元件和ATMP单元。生产挂钩激励计划(PLI)高达4095.1亿印度卢比的补贴将在5年内发放。
The Production Linked Incentive Scheme (PLI) for Large Scale Electronics Manufacturing proposes a financial incentive to boost domestic manufacturing and attract large investments in the electronics value chain including mobile phones, electronic components and ATMP units. Production Linked Incentives of up to INR 40,951 crores will be awarded over a period of 5 years.
符合申请PLI计划的目标产业
Target Segments Eligible under PLI Scheme
移动电话
Mobile Phones
特定的电子元件
Specified Electronic Components
表面贴装技术元件
SMT components
半导体分立器件，包括晶体管、二极管、晶体闸流管等
Discrete semiconductor devices including transistors, diodes, thyristors, etc.
电子应用的无源元件，包括电阻、电容等
Passive components including resistors, capacitors, etc. for electronic applications
印刷电路板（PCB）、PCB层压板、黏合片、光聚合膜、PCB印刷油墨
Printed Circuit Boards (PCB), PCB laminates, prepregs, photopolymer films, PCB printing inks
电子应用的感测器、转换器、制动器、晶体
Sensors, transducers, actuators, crystals for electronic applications
封装内系统（SIP）
System in Package (SIP)
微型/纳米电子元件，如微型机电系统（MEMS）和纳米机电系统（NEMS）
Micro / Nano-electronic components such as Micro Electromechanical Systems (MEMS) and Nano Electromechanical Systems (NEMS)
装配、测试、标记和包装(ATMP)单元
Assembly, Testing, Marking and Packaging (ATMP) units
本文来源：印度中资手机CMA1
